1) outside chip
跳屑
1.
Different reasons caused outside chip of terminal die are analyzed, the advantages and disadvantages of various solving steps and its applicable circumstance are classified and summarized, which can be a guidance to terminal die design and manufacture.
分析了端子模跳屑产生的不同原因,归纳总结了各种解决措施的优缺点,以及各自的应用场合。
补充资料：滴屑屑
1.颤抖貌。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。