1) gold-silicon alloy
金-硅合金
1.
The failure models of gold-silicon alloy bonding are discussed and some solving ways are proposed.
并主要针对在半导体器件中应用最为广泛的金-硅合金焊接失效模式及其解决办法进行了讨论。
2) gold-silicon alloys
金硅合金
3) silicon-manganese alloy
硅锰合金
1.
Rapid analysis of silicon,phosphorus and manganese contents in silicon-manganese alloy;
硅锰合金中硅、磷、锰的快速分析
2.
Dissolving sample with nitric acid and hydrofluoric acid,the silicon content of silicon-manganese alloy was made a measurement with ICP-AES method in the hydrofluoric acid-resistant spray devices.
用硝酸和氢氟酸溶解试样,采用耐氢氟酸雾化装置,用ICP-AES法测定硅锰合金中的硅。
4) ferrosilicon alloy
硅铁合金
1.
Determination of cobalt in ferrosilicon alloy by graphite furnace atomic absorption spectrometry;
石墨炉原子吸收光谱法测定硅铁合金中的痕量钴
2.
This paper presents simultaneous determination of Ca and Ba in ferrosilicon alloy by the X-ray fluorescence incremental method,and discusses the applied range for matrix effect correction and expansion contour.
介绍了X-射线荧光增量法[1]同时测定硅铁合金中的Ca、Ba,探讨了基体效应校正、扩展曲线的应用范围,方法准确度和精度高。
5) Al-Si Alloy
铝硅合金
1.
Modification mechanism of eutectic silicon in Al-Si alloys:impurity-induced coupled twinning;
铝硅合金中共晶硅的变质机理:杂质诱发共生成对孪晶
2.
Mechanism of Acid Pickling for Al-Si Alloy before Spiral Vibration Polishing;
铝硅合金螺旋振动抛光酸洗机理的探讨
3.
Effects of strong magnetic field on modification of Al-Si alloy;
强磁场对铝硅合金变质效果的影响
6) aluminum-silicon alloy
铝硅合金
1.
The effect of heat treatment on the structure and the mechanical property of the aluminum-silicon alloy without solidification shrinkage;
热处理对无凝固收缩铝硅合金组织和性能的影响
2.
Analysis on structure and fracture morphology of short fiber reinforced aluminum-silicon alloy composites;
短纤维增强铝硅合金复合材料的组织与断口形貌分析
3.
Determination of Si,Fe,Zn,Cu,Mn,Ti and Mg elements in aluminum-silicon alloy.;
铝硅合金中硅、铁、锌、铜、锰、钛、镁等元素的同时测定
补充资料：金硅合金
分子式：
CAS号：
性质：金基添加硅的二元合金，共晶温度363℃，浓度2.85％Si。有AuSi1.9、AuSi2和AuSi6等牌号。采用真空感应电炉熔炼。合金塑性差难加工。铸锭需经热开坯和冷加工成材。冷轧逐次加工率控制在5％～10％。已经轧制成厚0.015mm，长30m的薄带。用作半导体器件中芯片和框架自动焊的焊接材料，如三极管、彩电配套用变容管，频道开关和军用脉冲功率管等。AuSi1.9可用作电讯开关接点。
CAS号：
性质：金基添加硅的二元合金，共晶温度363℃，浓度2.85％Si。有AuSi1.9、AuSi2和AuSi6等牌号。采用真空感应电炉熔炼。合金塑性差难加工。铸锭需经热开坯和冷加工成材。冷轧逐次加工率控制在5％～10％。已经轧制成厚0.015mm，长30m的薄带。用作半导体器件中芯片和框架自动焊的焊接材料，如三极管、彩电配套用变容管，频道开关和军用脉冲功率管等。AuSi1.9可用作电讯开关接点。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条