1) anodic bonding
静电键合
1.
Investigation of the glass-ceramics used as anodic bonding material;
静电键合用微晶玻璃的研究
2.
Si - glass anodic bonding of high - temperature semiconductor pressure sensor;
半导体高温压力传感器的静电键合技术
3.
Analysis of current-time characteristic in silicon-glass anodic bonding;
硅-玻璃静电键合中的电流-时间特性分析
2) Electrostatic bonding
静电键合
1.
Electrostatic bonding method is proposed to combine GaAs photocathode materials and glass.
提出了用于GaAs光阴极粘结的静电键合方法。
2.
This paper introduced a new local electric field shield method, which could overcome the effects of electrostatic force on the MEMS sense film during Si -glass electrostatic bonding processes.
针对带弹性敏感薄膜结构的微机械器件的硅/玻璃静电键合,介绍了一种有效的方法——局部电场屏蔽法,在键合过程中屏蔽弹性敏感薄膜所在位置的电场,使薄膜结构不受静电力的影响,从根本上解决了薄膜受静电吸引力而产生形变,与玻璃贴合甚至破裂的问题,大大提高了成品率。
3) electrostatic-alloy bonding
静电-热键合
4) glass-silicon bonding
玻璃 硅静电键合
6) electrostatic bond strength
静电键强度
补充资料：电键
使电路开合或改变线路的装置。种类很多，特指发电报用的按键。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条