1) Pressure heads mechanism
压头机构
2) Prober equipment
探头机构
3) yarnreservemechanism
留头机构
4) head mechanism
焊头机构
1.
Secondly,the parts and assembly of the head structure and motion mechanism were designed by using pro/Engineer,the mechanim motion models and driving models were built,the motion simulation of the head mechanism was realized by using Mechanism/pro,the simulation results were analized,the head structure and mechanism parameters were optimized.
首先,分析了焊头总成的工作过程和要求,研究了焊头机构的工作原理,设计了曲柄摇杆结构的运动参数,开发了端面偏心轮机构,讨论了焊头机构的运动时间序列。
2.
In order to develop a bonding head mechanism with high-speed and high-precision characteristics and ensure the whole machine performance of automatic LED die bonders.
为了开发高速高精度焊头机构,确保全自动LED键合机的整机性能,在完成运动方案和结构参数设计后,研究了运用Pro/Engineer运动仿真模块Mechanism/Pro对整个焊头机构进行运动建模的技术与方法,包括机构模型创建、驱动控制等,进行了机构运动仿真;并对仿真结果进行了分析,验证了所设计的焊头机构的可行性和合理性。
5) bonder
[英]['bɔndə] [美]['bɑndɚ]
焊头机构
1.
An experimental platform of the IC die bonder has been manufactured,and parameters such as moving precision and position accuracy have been measured by using image recognition technology.
设计制造出IC芯片粘片机焊头机构的实验平台,采用图像处理的方式来测量焊头的运动精度和定位精度等参数。
6) die pressure
机头压力
1.
The model was used to describe the relationships between the input signals related to melt temperature and die pressure and the output signals concerning heat.
在聚合物精密挤出成型加工过程中,机头熔体温度与机头压力是影响精密挤出成型制品质量的关键因素。
补充资料：无弹性架压磁测力传感器压头
无弹性架压磁测力传感器压头
无弹性架压碰测力传感器压头
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条