1) Cu-Sn-P
Cu-Sn-P
1.
Study of Cu-Sn-P-Alloy Cladding Materials on Iron and Steel Surface by Means of XPS and AES;
用XPS和AES研究钢铁表面Cu-Sn-P合金镀层
2) Cu-Sn-P alloy
Cu-Sn-P合金
3) Cu-Sn-P-CdCr_2S_4
Cu-Sn-P-CdCr_2S_4
1.
Golden, bright and compact Cu-Sn-P ZnCr_2S_4 and Cu-Sn-P-CdCr_2S_4 nanometer composite coating were prepared on the surfaces of A3 steel by neutral electroless composite plating technology.
为了获得耐蚀性能优异的复合化学镀层,利用中性化学复合镀技术,在A3碳钢片表面制备了金黄色光亮致密的Cu-Sn-P-ZnCr_2S_4和Cu-Sn-P-CdCr_2S_4纳米复合化学镀层。
4) Cu Sn P Film Surface
Cu-Sn-P镀层表面
5) Cu Sn P alloy composition
PMTA
6) Cu-Sn-P/Ni-Sn-P
CuSnP/NiSnP
参考词条
补充资料:(-)-2,3-O-Isopropylidene-sn-glycerol
分子式:C6H12O3
分子量:132.16
CAS号:14347-78-5
性质:密度1.062。沸点72-73°C (8 mmHg)。折射率1.433-1.435。闪点80°C。比旋光度-13.7° (neat)。水溶性miscible。
分子量:132.16
CAS号:14347-78-5
性质:密度1.062。沸点72-73°C (8 mmHg)。折射率1.433-1.435。闪点80°C。比旋光度-13.7° (neat)。水溶性miscible。
说明:补充资料仅用于学习参考,请勿用于其它任何用途。