1) rhodium plating substrate
镀铑基材
2) Rhodium plating
镀铑
1.
Electrochemistry behavior and coating performance research about rhodium plating on different substrate metal material;
不同基材上装饰性镀铑的电化学行为及镀层性能
2.
A new rhodium plating process applicable to printed circuit board was optimized by orthogonal test.
镀铑层由于具有各项优异的性能 ,常用作电子、光学领域的功能及装饰性镀层。
3) plating substrate
电镀基材
4) Difficult to plate substrates
难镀基材
5) rhodium plating bath
镀铑溶液
1.
Rhodium in rhodium plating bath was determined by spectrophotometry with sodium hypochlorite as chromogenic agent.
用次氯酸钠作显色剂光度测定镀铑溶液中的铑。
2.
Rhodium in rhodium plating bath was determined by spectrophotometric method using potassium iodine and stannous chloride as chromogenic agent .
以碘化钾和氯化亚锡作显色剂,用光度法测定镀铑溶液中的铑。
6) rhodium electroplating solution
铑电镀液
补充资料：乙酰丙酮酰双(亚乙基)化铑
CAS: 12082-47-2
中文名称: 乙酰丙酮酰双(亚乙基)化铑
英文名称: ACETYLACETONATOBIS(ETHYLENE)RHODIUM(I)
中文名称: 乙酰丙酮酰双(亚乙基)化铑
英文名称: ACETYLACETONATOBIS(ETHYLENE)RHODIUM(I)
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条