1) re-inoculation
回流接种
2) Reflow soldering
回流焊接
1.
Attention questions and measures during BGA assembly were analyzed to increase BGA assembly quality by BGA package,PCB design,solder paste print,place BGA,and reflow soldering process.
从BGA的封装形式、PCB的设计、焊膏印刷、贴片、回流焊接工艺等方面分析了BGA组装过程中应注意的问题及其预防措施。
2.
Reflow soldering is a key chain in the SMT ,the function of the reflow soldering stove is to provide a requested-temperature condition on which the solders is melt and then cooling and becomes solid to form a soldering drop.
回流焊接是SMT工艺流程中重要的一环，回流焊炉的作用是提供一定的温度环境使焊锡膏熔化、而后降温固化在PCB上形成焊点。
3) reflow soldering
回流式焊接
5) current circuit connections
电流回路接线
1.
Its sensitivity and retiabili-ty for outside fault vary with different external current circuit connections, which greatly affect the protection operation.
ＬＣＤ－４型差动继电器用于变压器保护，当其外部电流回路接线不同时，其灵敏度及躲外部故障能力有很大的区别，对保护的动作行为有很大的影响。
6) reflow sealing process
回流焊接工艺
补充资料：被动免疫接种
被动免疫接种
passive immunization
将免疫个体的抗体或已接触抗原的致敏淋巴细胞注入另一个未免疫机体使之获得免疫的方法。保护作用比自动免疫接种出现早，但维持时间短。例如用白喉抗毒素、破伤风抗毒素进行被动免疫；应用免疫血清球蛋白防治风疹、免疫缺陷等。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条