1) glue feed
灌胶工艺
1.
Taking the installation of lathe bed and vertical shaft of computer numerical control machine as a example, a new glue feed technology was introduced, which is a promising method compared to traditional technique.
以立式数控加工中心的床身与立柱的安装为例,介绍了灌胶工艺新技术;与传统工艺比较,灌胶工艺技术是值得推广的先进方法。
2) grouting technology
灌浆工艺
1.
Chemical grouting technology for TGP s permanent shiplocks;
三峡永久船闸化学灌浆工艺
2.
The vacuum grouting technology used for construction of prestressed concrete bridges is presented.
介绍预应力混凝土结构施工中的真空灌浆工艺施工工法,提出确保真空灌浆工艺顺利实施的控制要点。
3) Embedding technology
灌封工艺
1.
The design of embedding,the selection of embedding material and the embedding technology process are separately described by analyzing the embedding technology for some HV(High Voltage) assembly(comprising power supply assembly,filament assembly and pulse modulator) in airborne SAR transmitter.
通过对灌封工艺技术在机载雷达发射机高压组件(包括电源组件、灯丝组件以及脉冲调制器)上的应用,介绍了雷达发射机高压组件的灌封工艺设计思路,并从材料优选及工艺流程等方面分别进行了叙述,多次试验证明,该硅橡胶灌封材料及灌封工艺满足产品的设计要求。
4) grouting process
灌浆工艺
1.
A new grouting process is studied which adding small amount of surfactant and coupling agent into water to make a new water emulsion used for improving the underwater concrete surface and adopting fast setting modified vinyl ester resin slurry or epoxy furfuralacetone with underwater curing agent to prepare grouting material.
研究一种新的灌浆工艺,在水中加入少量的表面活性剂与偶联剂制成可以用于改善水下混凝土表面的水乳液,采用可快速固化的改性乙烯基酯树脂浆材,或环氧糠叉丙酮与水下固化剂配制成灌浆材料。
5) crack filling program
灌缝工艺
6) bonding technology
胶接工艺
1.
Components qualities of bonding technology are influenced by many factors, which are complicated.
胶接工艺中构件质量受多种因素的影响,内容比较复杂。
补充资料：灌封胶
分子式：
CAS号：
性质：又称灌注胶。用于电子元件灌注密封的胶黏剂。主要有环氧树脂胶黏剂、室温硫化硅橡胶胶黏剂及有机硅凝胶等。使用时，将电子元件置于壳体或模型内，立即注入灌封胶，使整个元件浸没，待交联固化后不再取下壳体或卸下模具。多用于绝缘性能要求较高的电子元件的绝缘密封。
CAS号：
性质：又称灌注胶。用于电子元件灌注密封的胶黏剂。主要有环氧树脂胶黏剂、室温硫化硅橡胶胶黏剂及有机硅凝胶等。使用时，将电子元件置于壳体或模型内，立即注入灌封胶，使整个元件浸没，待交联固化后不再取下壳体或卸下模具。多用于绝缘性能要求较高的电子元件的绝缘密封。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条