Slicing large-diameter SiC single crystal by using diamond wire saw;

Study on the Manufacture of Electroplated Diamond Wire Saw and Slicing Technology;

The ultrasonic vibration cutting processing of electroplated diamond wire saw for hard and brittle materials was researched.

Through the theoretical deduction,the Kinematic equation,the velocity equation and the acceleration equation of the diamond wire saw during the manufacturing process are obtained.

Research on sawing forces during ultrasonic vibration cutting of hard and brittle materials with electroplated diamond wire saw;

In this paper,the principle,model,characteristics,materials,technics and applied example of electroplated diamond wire saw are summarized.

Based on the wave equation and the frequency equation,the analytical model of piezoelectric ceramic actuator for ultrasonic vibration cutting with electroplated diamond wire saw was established,and the structure sizes of the various components of piezoelectric ceramic actuator were gained.