1) direct bandgap Si-based low dimensional materials
直接带隙Si基低维材料
1.
The involved contents indude the design of direct bandgap Si-based low dimensional materials, fabrication of ordered Si-based nanocrystalline films and approach of stable and high-efficient Si-based light.
本文尝试性地评论了这一集Si材料技术、纳米技术、微电子技术以及光电子技术为一体的新型交叉学科,近年来在直接带隙Si基低维材料的设计、晶粒有序Si基纳米材料的制备与稳定高效Si基发光器件的探索等方面所取得的若干重要研究进展,并预测了全Si光电子集成技术的未来发展趋势。
2) direct wide gap material
直接带隙材料
3) direct wide band gap material
直接宽带隙材料
4) Si-based materials
Si基材料
5) low-dimension material
低维材料
1.
Phonon-glass electron-crystal(PGEC) and low-dimension materials are two kinds of potential thermoelectric materials.
声子玻璃电子晶体(PGEC)材料和低维材料是2种很有发展前景的热电材料。
2.
The coefficient of thermal expansion (CTE) is an important parameter attributing performances of materials However,there is no standard method to measure the CTE of low-dimension materials (one-dimensional wire stock and two-dimensional belt material) at present In this study,a measuring system is designed to solve the problem.
热膨胀系数是表征材料性能的一个重要参数 ,但目前对低维材料 (一维线材和二维带材 )的热膨胀系数尚无标准的测试方法。
6) low dimension materials
低维材料
1.
Catalysis is one of the fields which have initiated the use of low dimension materials for a long time.
催化是最早利用诸如纳米粒子和纳米线等低维材料的领域之一。
补充资料：直接带隙(见半导体的能带结构)
直接带隙(见半导体的能带结构)
direet band gaP
直接带隙direet band gap见半导体的能带结构。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条