The preparing methods,key technology,current status at home and abroad and the development directions of multilayer chip inductor,as well as the present research state of the materials fort MLCI At the same time the market and present and reviewed prospect of MLCI is forecaste

I have designed the multilayer chip inductor take this material as the foundation and discussed a little influences of the metal wire arrangement structure and via in the parameters of inductor.

The status and the development tendency of the low-temperature-sintering hexagonal ferrites used in the chip inductor were introduced .

In this paper, the influence of Cu2+ content on the sintering and electromagnetic properties of the low-temperture sintered MgCuZn ferrite were mainly introduced by summarizing and analyzing related literatures, and the probability of using MgCuZn ferrite as the core material for multilayer chip inductors was disscussed.

Based on the Japanese patents, the development of technological process of chip inductors in the past ten yesrs is overviewed by product type Emphasis is put on the improvement on materials, structures, manufacturing process and equipment of chip inductors for meeting the meeds of mass production and enhancing the propertie

As a result,a multilayer chip inductor with excellent electromangetic properties and filter from it suitable for high density surface mounted technology are made by special design and improved skill.

Research on the low temperature co-fired NiCuZn ferrite materials and multilayer chip inductor applications;

The multilayer chip inductors (MLCI) and the low temperature co-fired ferrites (LTCF) are the key technologies to realize the revolution of the third part.

The origin of the residual stress in multylayer chip inductor is introduced.

The developments in multylayer chip inductor and low temperature sintered ferrites, including NiCuZn ferrite, MgCuZn ferrite, Co2Z ferrite, are overviewed.