1) contact angles
接触角分布
2) Contact force distribution
接触力分布
3) contact pressure distribution
接触压强分布
1.
Then,the contact pressure distribution was calculated and analyzed in polishing experiments using ANSYS.
为了获得单晶硅片化学机械抛光过程中护环对接触压强分布的影响规律,从有护环化学机械抛光实际出发,建立了抛光过程的接触力学模型和边界条件,利用有限元法对有护环抛光接触状态时的接触压强分布进行了计算和分析,并利用抛光实验对计算获得结果进行了验证。
2.
In order to obtain the effect of carrier film on contact pressure distribution in the chemical-mechanical polishing(CMP) of silicon wafer,a mechanism model and a boundary equation were set up,then the contact pressure distribution was calculated and analyzed by use of finite element method,and the calculated result was verified by polishing experiments.
为了获得单晶硅片化学机械抛光过程中背垫对接触压强分布的影响规律,建立了有背垫抛光过程的接触力学模型和边界条件,利用有限元方法进行了有背垫时的接触压强分布的计算与分析,并利用抛光实验对计算结果进行了验证,获得了硅片与抛光垫的接触表面压强分布形态,以及背垫的物理参数对压强分布的影响规律。
3.
In order to obtain the contact pressure distribution and its effect on the flatness errors of aluminum hard magnetic disc substrates,based on the lapping practices of the substrates,the elastic contact mechanical model and boundary conditions between the substrate and PVA fixed abrasive stones are established when the substrate is lapped.
目的为了获得铝质硬磁盘基片研磨过程中的接触压强分布对基片平面度的影响规律。
4) Contact stress distribution
接触区应力分布
5) contact time distribution
接触时间分布
6) contact angle
接触角
1.
Influences of surface tension of acid solution and contact angle of rock on the cleanup efficiency of surfactant;
表面张力和接触角对酸液助排率的影响研究
2.
Comparison of hypsometry and goniometry in contact angle measurement;
接触角测量的量高法和量角法的比较
3.
Surface free energy of basalt and glass fibers by contact angle method;
接触角法测玄武岩及玻璃纤维表面能实验
补充资料：角分布
分子式：
CAS号：
性质： 微分截面λ(θ)随入射角θ的变化曲线。
CAS号：
性质： 微分截面λ(θ)随入射角θ的变化曲线。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条