1) Cu_6Sn_5 intermetallics
金属间化合物Cu6Sn5
1.
It was the formation and growth of Cu_6Sn_5 intermetallics at the interfaces of Sn60Pb40 solder and copper or brass w(copper) 62 % plate,and the coarsing of the microstructure during the heating cycle that were the important factors affecting the reliability of the soldering spots.
Sn60Pb40焊料与铜焊盘的焊接界面中金属间化合物Cu6Sn5的形成与长大以及在热循环过程中的组织粗化是影响焊点可靠性的重要因素。
2) Cu 6Sn 5 intermetallic compound
Cu6Sn5金属间化合物
3) Cu6Sn5 alloy
Cu6Sn5合金
1.
The first charge/discharge capacities of the Cu6Sn5 alloy electrode were measured respectively at 735 and 571 mAh·g-1,and a good retention of the capacities has been determined.
XRD结果给出其组成为Cu6Sn5合金,扫描电子显微镜(SEM)观察到Cu6Sn5合金电极为三维(3D)多孔结构。
4) Intermetallic Compound
金属间化合物
1.
Preparation of SbSn intermetallic compound with Al addition and desulfurization behavior for emulsion of crude oil;
金属间化合物SbSn的掺Al制备及原油乳液脱硫
2.
Status of intermetallic compound coatings synthesized by laser cladding;
激光熔覆在金属间化合物涂层材料制备中的应用
3.
Preparation,characterization and viscosity reduction for crude oil of single-phase SbSn intermetallic compound;
单相金属间化合物SbSn的制备、表征及其对原油降黏
5) IMC
金属间化合物
1.
Effect of the IMC in Sn-Ag-Cu Solders on Soldering Properties;
Sn-Ag-Cu焊料中金属间化合物对焊接性能的影响
2.
The Effects of High Magnetic Field on the Growth Behaviors of Tin-copper Intermetallic Compounds (IMC) Layers;
强磁场对锡铜金属间化合物生长行为的研究
3.
Growth behavior of intermetallic compounds (IMC) at SnAgCu/Cu interfaces under two kinds of thermal cycling and thermal aging condition was investigated.
通过对等温时效与温度循环两种条件下钎料与基板间金属间化合物(IMC)生长的对比,研究了界面IMC生长的规律。
6) intermetallic compounds
金属间化合物
1.
Refinement of intermetallic compounds of Zn-2Ni alloy;
Zn-2Ni合金金属间化合物的细化
2.
Effects of intermetallic compounds on the properties of Sn-Ag-Cu lead-free solder joints;
金属间化合物对Sn-Ag-Cu无铅钎料钎焊接头性能的影响
3.
The growth behaviors of intermetallic compounds between Sn-3.5Ag and Cu substrate;
Sn-3.5Ag/Cu界面金属间化合物的生长行为研究
补充资料：Ti_(3)Al基合金(金属间化合物)涡轮导风板
Ti_(3)Al基合金(金属间化合物)涡轮导风板
TiaA，基合金(金属间化合物)涡、、风*。利;:，
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条