Relationship among the solidification conditions, solid-liquid interface shapes and the preferred orientations of Tb0.

The effects of temperature gradient and interfacial growth velocity on solid-liquid interface morphology were studied with succinonitrile under the unidirectional solidification system.

The distribution of thermal stress in B/Al composite subjected to thermal-mechanical cycling (TMC) was simulated by ANSYS software; the evolvement of interface morphology and microstructure of B/Al composite subjected to thermal-mechanical cycling were observed by SEM and TEM, respectively, and the interfacial damage behavior was also studied.

Effect of interface topography on residual stress

The relation between the residual stress and the interface topography dimension was worked out.

The relationship between interface topography dimension and residual stress in thermal barrier coating during cooling of heat cycles is numerically simulated by finite element method in this paper.

To choose suitable growth speed,the shape of solid liquid interface has been investigated by quenching HgCdTe crystal with diameter of  19mm and composition of x = 0.