1)  nugget of RSW
焊点直径
2)  solder joint
焊点
1.
Effect of voids on the reliability of EBGA solder joints under thermal cycle;
热循环加载条件下空洞对EBGA焊点可靠性的影响
2.
Effect of temperature cycling stress profile on the thermal fatigue life of solder joints of QFP;
温度循环应力剖面对QFP焊点热疲劳寿命的影响
3.
Shape prediction and reliability analysis of QFP solder joint;
QFP焊点形态预测及可靠性分析
3)  soldered joint
焊点
1.
Optimum simulation and prediction on thermal fatigue life of soldered joints of QFP devices;
QFP组件的优化模拟及焊点热疲劳寿命的预测
2.
Effect of CPGA gull wing lead size on reliability of soldered joints;
引线尺寸对CPGA翼形引线焊点可靠性的影响
3.
Investigation for SnAgCu/Cu and SnAgCu/Au/Ni/Cu surface mounted soldered joints stored at high temperature;
SnAgCu/Cu和SnAgCu/Au/Ni/Cu表面贴装元件焊点高温存贮试验分析
4)  spot weld
焊点
1.
Put forward the features of spot weld in assembling welding and are pointed out and the mechanism of spot welding is analyzed in detail.
介绍微波组件的应用及其组装焊接的重要性,提出组装焊接中焊点的特点,并对焊点失效进行详细机理分析,阐述机械应力和热应力对焊点失效的影响,在焊接工艺和焊点设计方面找到抗失效断裂的有效措施,从而保证焊点的质量,提高微波组件的可靠性。
2.
And the draws of the stress, the whole life and the spot weld life of the crossmember are got after the analysis.
应用有限元分析法对副车架的疲劳台架试验进行强度和疲劳分析,得到副车架的应力分布图、副车架本体寿命云图和焊点寿命云图。
5)  Solder joints
焊点
1.
In situ observation and research on electrochemical migration of SnAgCu solder joints;
SnAgCu钎料焊点电化学迁移的原位观察和研究
2.
The microstructure and thermal fatigue behaviour of 62Sn--36Ph--2Ag solder joints;
62Sn-36Pb-2Ag焊点组织及热疲劳裂纹的萌生与扩展
3.
Image preprocessing of solder joints by X-ray;
基于X射线的焊点图像预处理方法及应用
6)  solder joint shape
焊点形状
1.
Effects of solder joint shape on joint reliability in SMT;
SMT中焊点形状对焊点可靠性的影响
参考词条
补充资料：当量比表面直径、表面积体积平均直径
分子式：
CAS号：

性质：又称当量比表面直径、表面积体积平均直径。是颗粒群表面积分布的平均直径。其意义为与颗粒群的粒形相同，总体积相同、总表面积相同，且粒度均匀的一个假想颗粒群的粒度。亦即指与该颗粒群的粒形相同，比表面积相同的一个颗粒的粒度。 

说明：补充资料仅用于学习参考，请勿用于其它任何用途。