1) curing stress
固化应力
1.
Study on Low Shrinkage Control Mechanism and Curing Stress of Low Profile Unsaturated Polyester Resin;
低轮廓不饱和聚酯树脂收缩控制机理及固化应力的研究
2.
The development of stress under one-dimensional(1-D) shrinkage constraint occurring after the gel point of the low profile UP and the effect of low shrinkage on curing stresses were investigated.
研究了在低轮廓不饱和聚酯(UP)树脂体系固化时的一维固化应力及低收缩添加剂(LPA)对固化应力的影响,发现LPA对于减小UP树脂体系的固化收缩应力具有明显的效果,LPA的含量、温度及LPA的类型对固化应力的产生和发展均有较大的影响。
3.
In this paper the development of the curing stress u nder one-dimensional shrinkage constraint is studied by self-made apparatus.
本文利用自制的测试固化应力的仪器测试研究了树脂固化时一维固化收缩应力的产生情况 ,然后通过低温固化低轮廓添加剂控制收缩 ,进一步测试研究其产生情况 ,观察了低收缩对固化应力的影响。
2) Solidifying stress
固化内应力
3) Cure kinetics
固化反应动力学
1.
The cure kinetics of the epoxy resin(N,N,N',N'-tetraglycidyl-4,4,-diaminodiphenyl methane,TGDDM)and the novel curing agent(2,2,-bis(3-amino-4-hydroxyphenyl)hexafluoro propane,BAHPFP)were studied by means of differential scanning calorimetry(DSC).
采用差示扫描量热法(DSC)研究了N,N,N',N'-四缩水甘油基-4,4’-二氨基二苯甲烷(TGDDM)与新型含氟固化剂2,2,-双(3-氨基-4-羟基苯基)六氟丙烷(BAHPFP)的固化反应动力学。
2.
The cure kinetics of middle temperature curing 3234 epoxy resin system was studied under isothermal and dynamic curing conditions by Differential Scanning Calorimetry (DSC) technique.
采用差示扫描量热法(DSC)在等温和动态条件下对3234中温固化环氧树脂体系的固化反应动力学进行了研究,建立了固化反应动力学方程;并模拟实际固化温度历程,采用测定不同固化阶段样品残余反应热的方法对固化反应动力学方程进行了验证。
3.
Non-isothermal cure kinetics of differential scanning calorimeter(DSC) showed that 1% surfactant exerts acceleration effect on the cure reaction of the epoxy,while 10% surfactant hinders the cure reaction.
DSC非等温固化反应动力学研究表明,1%(质量分数,下同)的表面活性剂对固化反应有促进作用,但10%的表面活性剂抑制了固化反应。
4) curing reaction kinetics
固化反应动力学
1.
Study on curing reaction kinetics and properties of epoxy potting compound
环氧灌封料固化反应动力学及其性能研究
2.
The curing reaction kinetics of BMI/DDE/F-51 were studied by DSC and the caculated results were apparent activation energy E_a=60.
用差示扫描量热仪(DSC)研究了BMI/DDE/F-51的固化反应动力学,求得固化反应表观活化能Ea=60。
3.
Firstly,curing reaction kinetics of SY H2 paste adhesive was researched by differential scanning Calorimeter(DSC).
首先采用差热扫描量热法 (DSC)研究了SY H2糊状胶粘剂固化反应动力学 ,根据Kissinger和Ozawa方法计算出胶粘剂的表观反应活化能分别为 10 2 3kJ/mol和 10 3 9kJ/mol,结合Crane公式求出反应级数为 0 94 3。
5) curing kinetics
固化反应动力学
1.
Study on the curing kinetics and properties of polyhedral oligomeric silsesquioxane(POSS)/epoxy hybrid resin system;
笼型倍半硅氧烷(POSS)/环氧杂化树脂体系固化反应动力学及性能研究
2.
Synthesis and Curing Kinetics of Epoxy Resin Tough Curing Agent;
环氧树脂柔性固化剂的合成及其固化反应动力学研究
3.
Study on the curing kinetics of SiO_2/CE/BMI composite
SiO_2/CE/BMI复合材料固化反应动力学的研究
6) curing reaction kinetic
固化反应动力学
1.
Study on the curing reaction kinetics of BMI/ER/DDS;
BMI／ER／DDS三元体系固化反应动力学研究
2.
Study on the curing reaction kinetics of F-51/DDS/PES;
F-51／DDS／PES三元树脂体系的固化反应动力学研究
补充资料：轧辊残余应力(见轧辊应力)
轧辊残余应力(见轧辊应力)
residual stresses in roll
zhagun eanyu yingli轧辊残余应力(residual stresses in roll)见礼辐应力。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条