1)  SiCp/Al
SiCp/Al
1.
Current Status and Development Prospect for SiCp/Al Metal-Matrix Composites for Electronic Packaging;
SiCp/Al电子封装复合材料的现状和发展
2.
Using SiC particles with different diameter,by effectively controlling the distribution of SiC particles,SiCp/Al composites with different SiC volume fraction(15%~65%) were fabricated under pressureless infiltration processing.
选用不同粒径大小的SiC颗粒,并通过对颗粒分布的有效控制,采用无压浸渗工艺制备了不同体积分数(15%~65%)的SiCp/Al复合材料,并在此基础上试制了梯度SiCp/Al复合材料。
3.
The author describes and discusses the effects of the structure of SiCp/Al material itself, cutting parameters and build-ups on the roughness of machined surface by means of sampling from cutting tests, getting Ra values with Tailor Profiler and taking SEM (scanning electron micrographs).
在切削试验取样基础上，借助泰勒轮廓仪采取Ra值和扫描电镜SEM拍照表面形貌的手段，描述和探讨了SiCp/Al材料本身组织结构、切削参数和积屑瘤等因素对已加工表面粗糙度的影响。
2)  SiCp/Al
纳米SiCp/Al 复合材料
3)  SiCp/Al MMCs
SiCp/Al基复合材料
1.
In order to analyze the weldability of SiC particle reinforced aluminum metal matrix composites(SiCp/Al MMCs),plasma arc in-situ welding of SiCp/Al MMCs was carried out using argon-nitrogen mixture as plasma gas with Ti-Mg mixed powder as in-situ material.
为分析SiCp/Al基复合材料的焊接性,以Ti-Mg混合粉末作为填充材料,采用氮氩混合等离子气体对SiCp/Al基复合材料进行等离子弧原位焊接。
2.
Plasma arc "in-situ" welding of SiCp/Al MMCs were carried out using argon-nitrogen mixture as plasma gases with Ti-Ni alloying as "in-situ" material.
以Ti-Ni合金作为填加材料,采用氮氩混合等离子气对SiCp/Al基复合材料进行等离子弧原位焊接。
4)  SiCp/Al composites
SiCp/Al复合材料
1.
Preparation of high volume fraction SiCp/Al composites for electronic packaging;
电子封装用高体积分数SiCp／Al复合材料的制备
2.
Anti-corrosion properties of electroless nickel coating on SiCp/Al composites;
SiCp/Al复合材料化学镀镍耐蚀性研究
3.
An Application of Focusing Probe in SiCp/Al Composites′ Nondestructive Testing;
聚焦换能器在SiCp/Al复合材料超声无损检测中的应用
5)  SiCp/Al composites
SiCp/Al基复合材料
1.
The paper is about craft experiment on SiCp/Al composites by the powder-EDM.
利用混粉电火花加工方法对SiCp/Al基复合材料进行了工艺实验。
6)  SiCp/Al composites
SiCp/Al 复合材料
参考词条
补充资料：(E)-2-Hepten-1-al
CAS: 18829-55-5
分子式: C7H12O
分子量: 112.17
沸点: 90-91℃
中文名称: E-2-庚烯醛

英文名称: (E)-2-Heptenal；(E)-2-Hepten-1-al；(e)-2-heptena；3-butylacrolein；beta-butylacrolein；trans-2-heptenal

说明：补充资料仅用于学习参考，请勿用于其它任何用途。