1) gold leaching
浸金
1.
Gold Leaching from Waste Printed Circuit Board by Thiocyanate Process;
废印刷线路板硫氰酸盐法浸金
2.
Factors influencing the gold leaching effect are as follows: leaching temperature,reaching time,and concentration of thiosulfate,Cu~(2+) and ammonia.
硫代硫酸盐浸金的主要影响因素有:浸取温度、反应时间、硫代硫酸盐浓度、二价铜离子浓度、氨浓度。
2) leaching gold
浸金
1.
Thus,it would be a potential technology for leaching gold.
与硫脲、氰化等浸金方法比较,石硫合剂法具有无毒、廉价易得、工艺简单、操作方便等优点,是一种具有开发潜力的浸金技术。
3) Leaching of gold
浸金
1.
The testing result indicats that the leaching rate can be up to more than 95% in leaching of gold from oxidized ores by biogenic solvents.
生物制剂浸金试验结果表明，生物浸金制剂对氧化型金矿金的浸出率大于９５％，对经过细菌预氧化的难浸金精矿金的浸出率与氰化法相
4) gold leaching condition
浸金条件
补充资料：汗浸浸
1.汗水浸湿貌。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条