Some new processes and technologies for electronics finishing were introduced, such as wafer plating, electrochemical mechanical polishing, microelectro-mechanical system plating, copper plating using insoluble anode, platinized niobium electrode, lead and cadmium free eleclroless nickel, recycling of alkaline etching solution and reclaiming system of copper.

Some new processes and technologies in electronics finishing such as wafer plating, eCMP,MEMS plating,lead and cadmium free electroless nickel,copper plating using insoluble anode and recycling of etching solution for PCB industry and platinized niobiumelectrode are briefly introduced.

Microchip Electrophoresis for Chiral Separations;

Research on three segments synchronization driving separating system for low voltage microchip electrophoresis

Rapid detection the SNP of Panax ginseng and P. quinquefolius by microchip electrophoresis

Simulation and analysis on the separation index of electrophoresis chip;

Research on Bio-Chemical Analysis System Based on Electrophoresis Chip with Arrayed-Electrode;

Design of contactless conductivity detecting circuit for electrophoresis chip

Micromachining of capillary electrophoresis chips is described.

Chip electrophoresis as a typical microfluidic system involves many aspects, such as substrate material, microf abrication method, control of microf luid, separation modes and detection methods.