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1)  multi-wire slicing
多丝切割
1.
Multi-wire slicing is a novel method in the field of wafer slicing;recently multi-wire saw has gradually replaced the method of ID saw,and become the prevailing equipment in this domain.
多丝切割是一种新型的硅片切片加工方法,近年来多丝切割已经逐渐取代内圆切割成为硅片切片加工的主流。
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2)  multi-wire sawing
多丝切割
1.
The ideal and single roll-indent sawing machining model cannot explain the whole multi-wire sawing process because the environment of the process is not ideal and the requirement of process is not always the same.
当前多丝切割的环境并非理想,加工要求并非相同。
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3)  cutting thread
切割丝
1.
According to the design theory of mechanical structure,in order to enhance cutting freedom,with major frame of the copper pipe and the bakelite,the kind of electric cutting thread with bow frame was developed.
根据机械结构设计原理,以提高切割自由度为设计目标,用铜管和电木作主要支承件,研制出弓架式切割丝支承体。
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4)  multi-cutting
多次切割
1.
Application of multi-cutting technique in high-speed linear cutting machine;
高速走丝线切割机床多次切割技术
2.
The analyses about multi-cutting conditions in WEDM-HS were given and some methods to assure steady multi-cutting were also discussed.
分析了高速走丝电火花线切割机床多次切割的条件及进行稳定多次切割需采取的措施,通过对机床机械结构及控制系统功能的改进与完善,采用洗涤性能良好的复合工作液,成功研制出具有稳定多次切割功能的商品化机床。
3.
Based on a number of factors influencing on the multi-cutting of Wire Electric Discharge - High Speed (WEDM-HS),an orthogonal experiment was performed to study the influence of pulse width,pulse interval,current peak, wire speed,the working fluid and the offset of the electrode wire on the processing efficiency and surface roughness for three-time cutting of WEDM-HS.
针对影响往复走丝电火花线切割多次切割的因素较多,采用正交试验的方法,进行放电脉宽、脉间、峰值电流、运丝速度、工作液及每次切割的偏移量对往复走丝电火花线切割3次切割的影响试验,确定影响加工效率和加工表面粗糙度的显著影响因素水平,优化加工参数,进行5次切割试验验证,获得工件加工表面粗糙度Ra0。
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5)  multitool dicing
多刀切割
1.
The application and maintenance of single phase input converter DV700T1500 produced by Panasonic in improving multitool dicing machine are described.
主要介绍松下公司生产的DV700T1500型单相输入的变频器在多刀切割机改进中的应用及其维护保养措施。
6)  Multi-wire saw
多线切割
1.
At present,the multi-wire saw has already replaced ID saw in longer ingot of semiconductor material slicing.
目前,在较长的硅单晶锭切割领域,多线切割机已基本取代内圆切片机。
2.
Multi-wire saw is a kind of machine that can make the silicon ingot into silicon wafer with different thickness.
多线切割机是一种将晶棒切割成晶片的设备,近年来得到大规模使用,其切割原理为利用高速运动的切割钢线将砂浆带入切割区,砂浆中的坚硬颗粒(主要为SiC)与晶棒进行磨削,进而起到切割作用。
3.
For the wafers prepared by multi-wire saw process,the warp distribution was measured with multi-point scan.
采用逐点扫描法对多线切割制备的晶片翘曲度分布进行了测量。
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补充资料：苄丝肼-左旋多巴,美多巴,复方苄丝肼胶囊
药物名称：美多巴

英文名：Medopa

别名：苄丝肼-左旋多巴,美多巴,复方苄丝肼胶囊
外文名：Benserazide-Levodopa, Madopar
适应症： 帕金森氏病、症状性帕金森氏综合症、（脑炎后、动脉硬化性或中毒性）。 参见“苄丝肼”.
用法用量：美多巴"250"片剂用法:
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早晨7:00 中午11:00 下午3:00 晚上7:00
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第一周 1/2 1/2 --- 1/2
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第二周 1/2 1/2 1/2 1/2
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第三周 1 1/2 1/2 1/2
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第四周 1 1 1/2 1/2
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第六和七周 1 1 1 1/2
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第八和第九周 1 1 1 1
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规格：片剂:苄丝肼-左旋多巴25mg-100mg/片, 50mg-200mg/片.




类别：抗震颤麻痹药
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条