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1)  Rhodium plating
镀铑
1.
Electrochemistry behavior and coating performance research about rhodium plating on different substrate metal material;
不同基材上装饰性镀铑的电化学行为及镀层性能
2.
A new rhodium plating process applicable to printed circuit board was optimized by orthogonal test.
镀铑层由于具有各项优异的性能 ,常用作电子、光学领域的功能及装饰性镀层。
2)  rhodium plating bath
镀铑溶液
1.
Rhodium in rhodium plating bath was determined by spectrophotometry with sodium hypochlorite as chromogenic agent.
用次氯酸钠作显色剂光度测定镀铑溶液中的铑。
2.
Rhodium in rhodium plating bath was determined by spectrophotometric method using potassium iodine and stannous chloride as chromogenic agent .
以碘化钾和氯化亚锡作显色剂,用光度法测定镀铑溶液中的铑。
3)  rhodium electroplating solution
铑电镀液
4)  rhodium plating substrate
镀铑基材
5)  rhodium-plating copper wire
镀铑铜丝
1.
The determination of rhodium in spent rhodium-plating copper wire was conducted by atomic absorption spectrometry in 10% hydrochloric acid.
用盐酸-过氧化氢溶解样品,加入镧盐抑制干扰,在10%盐酸介质中,空气-乙炔火焰原子吸收光谱法测定镀铑铜丝废料中的铑。
6)  rhodium(electro)plating
电镀铑
补充资料:(OC-6-11)-六氯合铑酸钠
CAS:14972-70-4
分子式:Cl6Rh·3Na
中文名称:氯化铑钠;(OC-6-11)-六氯合铑酸钠;氯铑酸钠

英文名称:Rhodium sodium chloride;hexachloro, trisodium, (OC-6-11)-Rhodate;Sodium rhodium chloride;sodium hexachlororhodate hydrate
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
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