1) cleanup technologies
返排工艺
2) reprocess technology
返修工艺
1.
Based on introducing some kinds of BGA package technology simply,the advantages of BGA package technology including the pin structure,package size and density were summarized,and the main points of reprocess technology were analyzed.
在简介各种焊球阵列(BGA)封装形式的基础上,归纳出BGA封装的技术优势,包括引脚结构、封装尺寸和封装密度等,并分析了BGA封装的返修工艺技术。
3) refuse discharge technique
排矸工艺
4) exhaust technology
排气工艺
1.
In this paper,the exhaust machine of the metal halide lamp's arc tube is designed and manufactured which is based on the characteristic of the metal halide lamp's exhaust technology.
本文根据小功率金属卤化物灯电弧管排气工艺特点 ,设计电弧管圆排机 ,分析小功率金卤灯电弧管内在质量的影响因素 ,并结合排气机在调试过程中采取的工艺措施进行初步探讨。
5) processing arrangement
工艺安排
6) technological air exhaust
工艺排风
补充资料：返返
1.形容往返不停。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条