1) healing-crystal
修复再结晶
1.
It was found that healing-crystal is primary self-healing mechanism of crack by modeling researching on the self-healing process of inner crack in material 20MnMo.
通过物理模拟研究20MnMo材料内部孔隙性缺陷的修复过程,建立了孔隙性缺陷高温修复的修复再结晶机理。
2) recovery and recrystallization
回复再结晶
3) recovery and recrystallization
回复与再结晶
1.
Through annealing and high temperature treatment,the recovery and recrystallization,the variations of microstructures and properties,and the thermal stability of submicron crystalline Cu-5%Cr wires after cold drawing have been investigated.
通过对冷拉拔的亚微米晶Cu-5%Cr丝材进行退火及高温热处理,研究其回复与再结晶、组织与性能的变化及其热稳定性。
4) dynamic recovery and recrystallization
动态回复再结晶
1.
The flow behavior and microstructure evolution during hot deformation were investigated in terms of the characteristic of dynamic recovery and recrystallization and the usefulness of rare earth phase.
5s-1条件下的热压缩变形规律进行了研究,对变形后的微观组织进行了金相分析,对显微组织中的第二相进行了扫描能谱成分分析,对变形后试样的硬度进行了测试,根据热加工动态回复再结晶的特点和稀土合金相的作用,分析了该合金的微观组织结构和变形行为。
5) Recovery and recrystallization
回复和再结晶
6) subgrain recovery and recrystallization
亚晶粒回复与再结晶
补充资料：二次再结晶(见再结晶晶粒长大)
二次再结晶(见再结晶晶粒长大)
secondary recrystallization
erCI 201」le」Ing二次再结晶(seeondary reerystallization) 见再结晶晶杠长大。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条