One kind of commercial WEDM-HS was successfully designed and launched on market through improving the structure of machine,innovating the control system and using composite cooling liquid which has powerful washing ability.

The experiment shows that the machining indexes of HSWEDM improve remarkably after using the composite cooling liquid with better washing ability to improve cooling situation at gap.

Interelectrode discharge mechanism and cutting technique rule of aluminum alloy cut by HSWEDM were studied by adopting the high efficiency cutting technology of aluminum alloy based on(using) composite cooling liquid as discharge dielectric to obtain even cooling gap situation.

Morphology feature and processing rule of cut mono-crystal silicon(mc-Si) based on complex dielectric fluid used in wire cut electric discharge machining with high traveling speed(WEDM-HS)is researched.

A solar wafer slicing method was studied,which was based on complex dielectric fluid and efficiency electric discharge machining(EDM) and electric chemical machining(ECM) technique.

A new technology cutting with synchronizing texturing on solar wafer is researched,which is based on complex dielectric fluid and using compound electric discharge machining(EDM) and electrochemical machining(ECM) technique.

The compound artificial synovia was prepared according to the table of orthogonal test design, which three factors-Hyaluronic Acid, γ- globulin and Lα-DPPC and five levels were considered.

In this paper the scanning scheme design problem under pulse doppler and stepped frequency compound work mode for the radar seeker of air-to-surface missile is discussed.