1) N,N',N'-tetraglycidyl-4,4'-diaminodiphenyl methane
N,N',N'-四缩水甘油基-4,4'-二氨基二苯甲烷
2) N,N,N',N'-tetraglycidyl-4,4'- diaminodiphenyl methane
N,N,N′,N′-四缩水甘油基-4,4′-二氨基二苯甲烷
3) N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenyl methane(TGDDM)
N,N,N',N'-四缩水甘油基-4,4'-二氨基二苯甲烷(TGDDM)
4) 4,4'-methylenebis(n,n-dimethyl-anilin
N,N,N',N'-四甲基-4,4'-二氨基4,4'-二苯基
5) tetraglycidyl-4,4'-diaminodiphenyl methane
四缩水甘油基-4,4'-二氨基二苯甲烷
1.
The curing process of tetraglycidyl-4,4'-diaminodiphenyl methane(TGDDM)/1,4-bis(4-aminophenoxy) benzene(144BAPB) was studied by the non-isothermal differential scanning calorimetry(DSC),and a kinetic analysis was made on the curing process by using Kissinger,Crane and Arrhenius equations,which educed the curing kinetic parameters of the system.
采用非等温差示扫描量热法(DSC)对四缩水甘油基-4,4’-二氨基二苯甲烷(TGDDM)/1,4-双(4-氨基苯氧基)苯(144BAPB)的固化过程进行了跟踪,并利用Kissinger、Crane和Arrhenius方程对该固化反应进行了动力学分析,求得了体系的固化动力学参数。
6) 4,4'-methylenebis(n,n-dimethyl-anilin
N,N,N'N'-四甲基-4,4'-二氨基二苯甲烷
补充资料：二氨基二苯甲烷
二氨基二苯甲烷又称甲撑二苯胺，简称DD50或MDA，分子量198．3。白色结晶粉末，相对密度(20℃／4℃)1．15，熔点89～90 ℃，沸点232℃(1.2kPa)。溶于丙酮、甲醇。难溶于苯、乙醚。有毒，LD50 252mg／kg。
用作环氧树脂的耐高温固化剂，参考用量25～30phr，适用期8h(100g)，固化条件100 ℃／2h十150 ℃／2h。固化物热变形温度155℃，长期受日光照射后变为暗褐色。
用作环氧树脂的耐高温固化剂，参考用量25～30phr，适用期8h(100g)，固化条件100 ℃／2h十150 ℃／2h。固化物热变形温度155℃，长期受日光照射后变为暗褐色。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条