1) silicon-copper mass
硅铜触体
1.
For attaining this it was necessary that monitoring rial quality and adjusting to silicon-copper mass in the reaction process.
为达到此目的,监测原材料的质量和调整反应过程中硅铜触体是必需的。
2) Cu-W solid contact
铜钨整体触头
4) Brass Contact Piece
黄铜触片
1.
Design of Multi-position Progressive Die for Brass Contact Piece;
黄铜触片多工位级进模设计
5) Cu-W contact
铜钨触头
6) copper-chromium contact
铜铬触头
1.
This paper describes the microstructure of copper-chromium contact and forming mechanism, the process factors affecting the crystallized structure as well as the influence of microstructure on electric properties.
论述了铜铬触头的金相组织与形成机理、金相组织对电气性能的影响及影响结晶组织的工艺因素,阐明了电弧熔炼法铜铬触头材料具有铬在铜基体中呈均匀细小弥散分布的铜铬组织;在开断能力、抗熔焊性、介质恢复强度等电气性能方面均明显优于传统粉末冶金法铜铬触头材料。
补充资料：氮化硅纤维增强体(见氮化硅纤维)
氮化硅纤维增强体(见氮化硅纤维)
silicon nitride fibres reinforcements
夔薰黔慧燃泳
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条