1) chip removal
排屑
1.
Based on the analysis of tapping force system and characteristic of chip removal, it is confirmed that radial force, axial force and jam of chip removal are the main reasons for poor thread quality.
通过对攻丝切削力和丝锥排屑特点的分析,确定径向力、轴向力和排屑不畅是影响攻丝质量的主要因素。
2.
The main factors that affect deep drilling in NC machine are introduced, such as chip removal, tool cooling and angular axis.
指出在数控深孔钻床上完成深孔加工的主要影响因素是解决排屑、冷却和防止钻孔轴线歪斜等问题,介绍了采用穿轴式高压冷却系统和带有开放式钻槽的枪钻,选择合理的切削参数并且可以单次退刀完成钻孔的加工方法,是深孔加工的一种较佳工艺组合。
2) chip cleaning device
排屑器
1.
According to chip cleaning device malfunction, the text firstly adopt FTA after make a fault tree and get the direct reason.
根据排屑器故障建立故障树,分析其产生的直接原因,通过对故障原因机理进行推理,分析得出发生故障的实质原因,并提出排屑器改进设计方案。
4) outside chip discharge
外排屑
1.
This paper introduces the operation principle,structure of four-tooth outside chip discharge set of material device and main parameter determination of cutting amount.
介绍四齿外排屑套料装置的工作原理、结构及切削用量主要参数的确定。
5) chip-ejection interference
排屑干涉
6) scraps removing mechanism
排屑装置
补充资料：火屑
1.极小的火点。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条