1) electroless Ni-P plating
化学镀Ni-P
1.
Study of electroless Ni-P plating on the diamond;
金刚石表面化学镀Ni-P的研究
2.
The low temperature bonding between 95%Al2O3 ceramics and 45 steel was realized through first electroless Ni-P plating on Al2O3ceramic blocks and then soldering them to steel blocks with a low melting point filler metal of 63Sn-34Pb-2Ag-1Bi alloy.
采用化学镀Ni-P膜法金属化Al2O3陶瓷,并用63Sn-34Pb-2Ag-1Bi钎料膏实现了95%Al2O3陶瓷与45钢之间的低温钎焊。
2) electroless plating Ni-P
化学镀Ni-P
1.
In order to improve the deposition rate and anti-corrosion properties of electroless plating Ni-P on aluminum,effects of stabilizing agents and surface active agents on the deposition rate and corrosion resistance of electroless plating Ni-P were studied.
为了改善铝基体上化学镀Ni-P存在的镀速慢、镀层腐蚀性能差等问题,研究了稳定剂和表面活性剂对铝化学镀Ni-P镀层的沉积速度、硬度、孔隙率、结合力、耐蚀性、腐蚀电位、表面形貌等性能的影响。
2.
In order to improve the corrosion resistance of ZL101A alloy, the electroless plating Ni-P coatings with and without electroplating Cu layer were investigated by potentiodynamic polarization, salt spary test, SEM, microhardness meter.
为提高ZL101A合金的耐蚀性能,可直接化学镀Ni-P或电镀Cu后化学镀Ni-P在其表面施加镀层。
3) electroless Ni-P
化学镀Ni-P
1.
In order to improve the corrosion resistance of A356 alloy,electroless Ni-P coatings were plated on the A356 alloy with and without a Ni pre-electroplating and then their corrsion performance was investigated by potentiodynamic polarization,salt spary test,SEM and microhardness.
用直接化学镀Ni-P和先电镀Ni后化学镀Ni-P两种方法在A356合金表面施加镀层。
2.
Electroless Ni-P has been widely used in the microelectronic packing in the recent years because of the better solderability and diffusion barrier.
化学镀Ni-P是一种优异的钎焊阻挡层材料,具有良好的可焊性,近年来在微电子封装工业中得到了广泛的应用。
4) Ni-P electroless plating
Ni-P化学镀
1.
The reaction mechanisms of Ni-P electroless plating and Ni-P-SiC composite electroless plating are researched, and the reaction thermodynamics are analyzed.
本文论述了Ni-P化学镀和Ni-P-SiC复合化学镀的反应机理,并对化学镀反应的热力学和动力学进行了分析。
2.
Ni-P electroless plating was adopted to encapsulate the as-received CaF2 in the preparation of precursor mixed powders of NiCr-Cr3C2-40%CaF2(wt.
%)复合合金粉末为原料,采用Nd:YAG激光熔覆技术,在γ-TiAl合金基体表面成功制备出了高温自润滑耐磨复合材料涂层,在复合粉体准备时,采用Ni-P化学镀包覆原始CaF2颗粒,以减少其在激光熔覆过程中的分解、蒸发和上浮。
5) electroless Ni–P plating
化学镀Ni–P
1.
The surface of eccentric wheel was plated using electroless Ni–P plating and the process flow and formulation were presented.
采用化学镀Ni–P工艺对其表面进行镀覆处理,给出了工艺流程和规范,讨论了前处理工艺、零件装载量及搅拌频率、镀层中P含量对镀层性能的影响,确定了最佳工艺条件:(6±0。
6) Electroless Ni-Q plating bath
化学镀Ni-P镀液
补充资料：镀覆用化学品
分子式：
CAS号：
性质：在印制电路板生产中涉及到化学镀铜、电镀铜、电镀锡/铅、电镀金、电镀镍等许多镀覆工艺。在基板上镀覆金属镀层主要有以下作用：(1)在通孔上进行化学镀以使双面板正反面相连或使多层板各层相连；(2)电镀通孔或在板上电镀电路图形；(3)在电路上镀保护层以防其氧化并作为下道腐蚀工序的抗蚀镀层；(4)在印制板上镀覆接触键(插头座)。另外，在集成电路和电子元器件生产制造过程中也涉及许多镀覆工艺。镀覆化学品系指上述镀覆工艺使用的一系列化学镀液和化合物。化学镀液的技术性、专用性、配套性很强，同一类镀液各公司的配方不尽相同，镀液性能及其使用工艺对镀层的质量有很大影响。
CAS号：
性质：在印制电路板生产中涉及到化学镀铜、电镀铜、电镀锡/铅、电镀金、电镀镍等许多镀覆工艺。在基板上镀覆金属镀层主要有以下作用：(1)在通孔上进行化学镀以使双面板正反面相连或使多层板各层相连；(2)电镀通孔或在板上电镀电路图形；(3)在电路上镀保护层以防其氧化并作为下道腐蚀工序的抗蚀镀层；(4)在印制板上镀覆接触键(插头座)。另外，在集成电路和电子元器件生产制造过程中也涉及许多镀覆工艺。镀覆化学品系指上述镀覆工艺使用的一系列化学镀液和化合物。化学镀液的技术性、专用性、配套性很强，同一类镀液各公司的配方不尽相同，镀液性能及其使用工艺对镀层的质量有很大影响。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条