1) wafer level micropackaging
芯片微封装
1.
In this paper, a novel packaging structure model which is performed using wafer level micropackaging on the thin silicon substrate as the Ka band distributed MEMS phase shifters wafer with vertical feedthrough is presented.
本文提出一种适用于Ka波段分布式MEMS移相器的新型封装结构——具有垂直互连线的薄硅作为分布式MEMS移相器衬底,并用芯片微封装方法对移相器进行封装。
2) Encapsulation of microfluidic chips
微流控芯片封装
3) IC packaging
芯片封装
1.
Finite element analysis of high acceleration and high precision stage for IC packaging;
面向芯片封装高加速度高精度气浮定位平台的有限元分析
2.
Based on the AC permanent magnetic synchronous linear motor in IC packaging devices, the fundamental principle of linear motor is introduced and a simple but effective model is established.
针对高速高精芯片封装平台的交流永磁直线同步电机驱动系统,阐述直线电机运行的基本机理,并建立简洁实用的数学驱动模型。
4) chip scale package
芯片级封装
1.
Chip scale package (CSP) for flip-chip on hard substrates and wafer re-distribution is studied, and its process flow is described.
对刚性基板倒装式和晶圆再分布式两种结构的芯片级封装(CSP)进行了研究,描述了CSP的工艺流程;详细讨论了CSP的几项主要关键技术结构设计技术,凸点制作技术,包封技术和测试技术;阐述了采用电镀和丝网漏印制备焊料凸点的方法。
5) MCP
多芯片封装
1.
Multi-chip packaging ( MCP ) technologies and their basi status, state-of-art of applications for mobile phone memory are reviewed in this paper.
文章评述多芯片封装技术及目前的基本情况,这一技术在手机存储器的应用现状等。
2.
In this thesis,the application of the failure analysis in MCP package technology will be addressed along with some general FA instrument and methods.
本文将主要讨论现阶段一般的封装失效分析的技术与设备,并且重点研究失效分析技术在多芯片封装领域的应用。
6) single chip package,SCP
单芯片封装
补充资料：微旨
1.亦作"微恉"。亦作"微指"。 2.精深微妙的意旨。 3.隐而未露的意愿。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条