当前类别：材料英语
电压坡：voltage gradient
电压降：voltage drop
电压对比/电位对比：voltage contrast/potential contrast
电压穿透式多色荧光粉：voltage penetration multicolor phosphor
电压崩溃：voltage collapse
电器用硅 [硅] 钢片：Electrical Steel Sheet
电气石：tourmaline
电炉：EAF
电流恒定极化曲线：galvanostatic polarization curve
电介质随时间变化破坏试验：time dependent dielectric breakdown test
电解研磨修整：grinding with electrolytic inprocess dressing
电浆喷敷法：plasma spraying
电积镀锌法：galvanizing
电弧石英玻璃坩埚：arc quartz glass crucibles
电感性耦合等离子体增强型CVD 系统：inductive coupled plasma enhanced CVD system
电镀金属钢片：Plate Metal Strip
电镀本领：throwing power
电池腐蚀：galvanic corrosion
电[池性]沈积：Galvanic deposit
点缺陷：point defect
点刻雕：stipple engraving
点火拱：ignition arch
点火不良，无法发射：misfire
颠倒金字塔型吸具：inverted pyramidal collet
碲锌镉衬底材料：cadmium zinc tellutide substrate material
碲化铅单晶：lead telluride
缔卷物：textured yarns
缔卷纱：Yarns,textured
缔卷定向：textured orientation
第三构架：tertiary structure
第二展向系数：second virial coefficient
第二接合点剥离：second bond off
第二接合，第二压接：second bonding
地质化学：geochemistry,geological chemistry
地形：terrain
地下建筑：underground buildings
地龙墙：pigeon-holed foundation wall,sleeper wall
地磁场：geomagnetic field
底座排水装置：underdrain equipment
底涂层：primer
底涂(珐琅)：ground-coat
底衬物：substrate
涤纶丝筛网：terylene fibre bolting cloth
涤纶薄膜电容器外包封料：outside encapsulate compound for terylene film condenser
涤纶薄膜电容器内包封料：inside encapsulate compound for terylene film condenser
低折射率[光学]玻璃：light
低胀玻璃：low-expansion glass
低压汽相磊晶生长系统：low pressure vapor phase epitaxial growth system
低压CVD 系统：low pressure CVD system
低温蚀刻：low temperature etching
电压降：voltage drop
电压对比/电位对比：voltage contrast/potential contrast
电压穿透式多色荧光粉：voltage penetration multicolor phosphor
电压崩溃：voltage collapse
电器用硅 [硅] 钢片：Electrical Steel Sheet
电气石：tourmaline
电炉：EAF
电流恒定极化曲线：galvanostatic polarization curve
电介质随时间变化破坏试验：time dependent dielectric breakdown test
电解研磨修整：grinding with electrolytic inprocess dressing
电浆喷敷法：plasma spraying
电积镀锌法：galvanizing
电弧石英玻璃坩埚：arc quartz glass crucibles
电感性耦合等离子体增强型CVD 系统：inductive coupled plasma enhanced CVD system
电镀金属钢片：Plate Metal Strip
电镀本领：throwing power
电池腐蚀：galvanic corrosion
电[池性]沈积：Galvanic deposit
点缺陷：point defect
点刻雕：stipple engraving
点火拱：ignition arch
点火不良，无法发射：misfire
颠倒金字塔型吸具：inverted pyramidal collet
碲锌镉衬底材料：cadmium zinc tellutide substrate material
碲化铅单晶：lead telluride
缔卷物：textured yarns
缔卷纱：Yarns,textured
缔卷定向：textured orientation
第三构架：tertiary structure
第二展向系数：second virial coefficient
第二接合点剥离：second bond off
第二接合，第二压接：second bonding
地质化学：geochemistry,geological chemistry
地形：terrain
地下建筑：underground buildings
地龙墙：pigeon-holed foundation wall,sleeper wall
地磁场：geomagnetic field
底座排水装置：underdrain equipment
底涂层：primer
底涂(珐琅)：ground-coat
底衬物：substrate
涤纶丝筛网：terylene fibre bolting cloth
涤纶薄膜电容器外包封料：outside encapsulate compound for terylene film condenser
涤纶薄膜电容器内包封料：inside encapsulate compound for terylene film condenser
低折射率[光学]玻璃：light
低胀玻璃：low-expansion glass
低压汽相磊晶生长系统：low pressure vapor phase epitaxial growth system
低压CVD 系统：low pressure CVD system
低温蚀刻：low temperature etching